Michiel Van Kenhove Presents Cyber-physical WebAssembly Research at WASI SubGroup Meeting

On October 31, 2024, Michiel Van Kenhove from IMEC, a partner in the ELASTIC Project, shared key updates during the WebAssembly System Interface SubGroup (WASI-SG) meeting. The session highlighted IMEC’s advancements in secure and modular hardware interfaces for cyber-physical systems.

Michiel announced the submission of IMEC’s paper, “Cyber-physical WebAssembly: Secure Hardware Interfaces and Pluggable Drivers,” to the IEEE/IFIP NOMS 2025 conference. He also provided a preprint of the submission for review and feedback from the WebAssembly community.

Additionally, Michiel promoted the First IEEE/IFIP WebAssembly, Cloud and Edge: Shaping the Future of Computing (WACE) Workshop, encouraging participants to submit their work and spread the word within their networks.

For more details, including links to the shared materials, refer to the official meeting notes.

Keep following IMEC’s contributions to the ELASTIC Project as they continue to advance the integration of WebAssembly in cyber-physical systems.